NX Electronic Systems Cooling

Category:
Course Type:
Duration: 3 Days
Location: Cranfield
User Level: Beginner to Intermediate

Course Objective;

The Electronic Systems Cooling course provides students with comprehensive instruction in the use of NX to build Electronic Systems Cooling models, simulating heat transfer and 3D fluid flow in electronics applications. Students will learn the skills necessary to build or modify geometry, create a finite element mesh, and carry out sophisticated thermal and fluid flow analysis quickly and easily.

The course covers both theoretical and practical aspects of how the software handles heat transfer by conduction, convection and radiation and includes a variety of examples and tutorials addressing techniques for each step in the process.

Who's it for?

Designers, engineers who use NX to model heat transfer and fluid flow in electronics applications.

Course Agenda:

  1. Introduction to NX
  2. Geometry idealization and fluid volume creation
  3. Meshing and material properties for thermal and flow analyses
  4. Heat transfer and electronics thermal management
  5. Computational fluid dynamics
  6. Thermal and flow boundary conditions
  7. Thermal couplings and radiation
  8. Solution options and solving
  9. Post processing
  10. Results mapping
  11. PCB Exchange introduction

Start your training

Learn everything you need to know about Siemens PLM techology, sign up here today

Enquire about this course
  • This field is for validation purposes and should be left unchanged.

How can we help?
Technical support for all our products.

Talk with our experts and explore our customer portal to manage and track your questions as well as explore our product advise and support guides.

Call +44 (0) 1234 757 695
Email us
Send us a question
Visit our portal

Sign up to receive event and technology updates